The development of integration and miniaturization of power electronic devices places higher demands on the thermal management technology of materials. Interface thermal resistance is a core bottleneck restricting their thermal conductivity

mainly resulting from poor physical contact

mismatch in phonon vibration characteristics

and interfacial chemical disorder. From the perspective of interface engineering

this paper reviews the optimization strategies for reducing interface thermal resistance

including the self-optimization of filler size

morphology

and orientation

the functional modification of surface covalent and non-covalent bonds

as well as the design of heterogeneous structures such as core-shell

bionic

and multi-dimensional synergy. Moreover

this paper comparatively analyzes the advantages

disadvantages

and applicable scenarios of different orientation methods

the thermal conductivity improvement effects of different modifiers and different core-shell structures

and the synergistic performance of multi-dimensional synergistic modification. Finally

this paper summarizes the existing problems in the current research on interface engineering of polymer insulating composites and prospects in the future development directions such as multi-scale theoretical simulation and microscopic visualization

aiming to prepare multifunctional and high-efficiency heat-dissipating composites.