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A lifetime prediction model for IGBT modules considering the coupling aging effect of solder layers
更新时间：2026-10-19

    • A lifetime prediction model for IGBT modules considering the coupling aging effect of solder layers

    • Engineering Journal of Wuhan University   Vol. 59, Issue 9, Pages: 1528-1537(2026)

    • DOI：10.14188/j.1671-8844.2026.0002    

      CLC： TM 46

    • Received：04 January 2026，

      Published：15 September 2026

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  • CHENG Rui,HE Yigang,CHI Yongning,et al.A lifetime prediction model for IGBT modules considering the coupling aging effect of solder layers[J].Engineering Journal of Wuhan University,2026,59(9):1528-1537. DOI： 10.14188/j.1671-8844.2026.0002.

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Related Author

Baichao CHEN
Tianyue LI
Cuihua TIAN

Related Institution

School of Electrical Engineering， Wuhan University
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